jongyonkim
Electrical
- Aug 3, 2006
- 24
Hi,
I'm simulating the bending of a sheet of (amorphous, poly)silicon of ~300um in thickness.
Currently, I have the following material properties
density
young's modulus
poisson's ratio
I consider 2% strain the breaking point (my definition of "damage"), which can be obtained from LE (logarithmic Strain) or when it reaches the yield stress/strength.
I could also input yield strength and plastic strain, but if I did this, how would I know when the material has "yielded"? (when Mises reaches Yield strength?)
Is this considered "enough" to study the bending behavior of silicon? Which properties do you think are considered "minimum/essential" material properties? (I'm an electrical engineer, so I don't have too much insight in mechanical properties).
Thank you in advance.
I'm simulating the bending of a sheet of (amorphous, poly)silicon of ~300um in thickness.
Currently, I have the following material properties
density
young's modulus
poisson's ratio
I consider 2% strain the breaking point (my definition of "damage"), which can be obtained from LE (logarithmic Strain) or when it reaches the yield stress/strength.
I could also input yield strength and plastic strain, but if I did this, how would I know when the material has "yielded"? (when Mises reaches Yield strength?)
Is this considered "enough" to study the bending behavior of silicon? Which properties do you think are considered "minimum/essential" material properties? (I'm an electrical engineer, so I don't have too much insight in mechanical properties).
Thank you in advance.