lling
Industrial
- Feb 19, 2007
- 3
Hi everyone,
I am very glad to find this site. I hope some experts here can help me to solve our problems.
We are a millimeter wave components and subsystem company. Most of our housings are made of Aluminum 6061-T6, type III soft gold plating, per MIL-G-45204. The detail plating specs are:
PER MIL-G-45204, REV C
100 micro-inches(min) of type III gold over 100-150 micro-inches of electroless nickel per MIL-C-26074, Rev E,Class4. 200 degree C Bake Test for 5 minutes.
Occasionally, we got some RMA(returned parts), because gold is lifted from aluminum floor, blisters are also found, which was believed was caused by the moisture trapped under nickel and gold before plating, which is the conclusion from a Material Analysis Lab. In order to get rid of moisture, after discussed with plating company, our plating specs was changed to:
PER MIL-G-45204, REV C
100 micro-inches(min) of type III gold over 100-150 micro-inches of electroless nickel per MIL-C-26074, Rev E,Class4. 350 degree C adhesion Bake Test for 15 minumtes, before plating, after nickle plating and after gold plating.
After the 350 degree C high temperature baking, about 50% parts failed. Some of our engineers question: is 350 degree C too high for Aluminum 6061-T6?
My questions: do you have the same experience ? How did you solove the problems? What is the standard bake temperature for Aluminum 6061-T6 parts? Please contact me if you have any clue. Thanks.
I am very glad to find this site. I hope some experts here can help me to solve our problems.
We are a millimeter wave components and subsystem company. Most of our housings are made of Aluminum 6061-T6, type III soft gold plating, per MIL-G-45204. The detail plating specs are:
PER MIL-G-45204, REV C
100 micro-inches(min) of type III gold over 100-150 micro-inches of electroless nickel per MIL-C-26074, Rev E,Class4. 200 degree C Bake Test for 5 minutes.
Occasionally, we got some RMA(returned parts), because gold is lifted from aluminum floor, blisters are also found, which was believed was caused by the moisture trapped under nickel and gold before plating, which is the conclusion from a Material Analysis Lab. In order to get rid of moisture, after discussed with plating company, our plating specs was changed to:
PER MIL-G-45204, REV C
100 micro-inches(min) of type III gold over 100-150 micro-inches of electroless nickel per MIL-C-26074, Rev E,Class4. 350 degree C adhesion Bake Test for 15 minumtes, before plating, after nickle plating and after gold plating.
After the 350 degree C high temperature baking, about 50% parts failed. Some of our engineers question: is 350 degree C too high for Aluminum 6061-T6?
My questions: do you have the same experience ? How did you solove the problems? What is the standard bake temperature for Aluminum 6061-T6 parts? Please contact me if you have any clue. Thanks.