AEH3
Materials
- Nov 9, 2005
- 5
I am trying to etch the grain boundaries of some polished SiC materiallography specimens to look at grain size/shape. I have used boiling Murakami etchant (KFe(CN)6:NaOH:10 H2O)for up to 15 minutes. Sometimes it works, sometimes it doesn't. I mix it up fresh each time because I understand it degrades quickly.
How about plasma etching? I have read that a CF4/O2 plasma works. I have a microwave plasma unit and am trying to decide if it is worth buying the gases and dealing with the safety issues.
Thanks,
AEH
How about plasma etching? I have read that a CF4/O2 plasma works. I have a microwave plasma unit and am trying to decide if it is worth buying the gases and dealing with the safety issues.
Thanks,
AEH