Memory manufacturing process (sram and dram, etc) regularly go through changes. These changes are typically die shrink. A die shrink yields changes in performance such as faster access time, reduced currents faster rise times, etc. In my past experience it was a normal process to qualify new die...
I am a experienced component engineer that has worked at my current company for 7 months. It is a medical device company. On our "AVL" we have a part # that is described as follows: AVL CAP,0.1UF,50V,Z5U,0805
This particular device configuration is at the high end of the capacitive...
