When modeling chip-submount assemblies for thermal analyses, the difficulty is often modeling the entire assembly due to significant dimension differences (small chip on large submount). I remember reviewing procedures that involve decoupling the model and solving the components separately per...
I implemented a frequency analysis for a specific structure to determine the natural frequencies. My general understanding of modal analysis is that in most cases, a first or second mode near an operating frequency may cause vibration amplification. For other designs, I have verified that the...
I am developing a few simple thermal models to evaluate some specific steady-state characteristics; I am using a linear FEA program.<br>
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When setting the boundary conditions, I would like to include the free convection coefficients at appropriate edges. If I do not include convention, the...
