hi all,
I am looking for the testing method for flexural strength of ceramic and I come across several different type. Does anyone know the difference between ASTM-F417, ASTM-F394 and ASTM-C1161?
Another question is, whether the speed of the loading will influence the flexural strength of the...
Hi,
Does anyone know of an effective method to clean the flux residue of a SAC305 solder joint? I need to totally remove the residue in order to ensure no delamination effect of the silicone rubber layer and the solder joint.
Thank you!
Best regards,
ct
Hi,
I'm looking for ways on how to detect delamination effect of a clear silicone rubber layer adhered to a white color surface. Can anyone shed some light here? Thanks!
Best regards,
ct
OK, let me rephrase this, I'm looking for a type of solder paste which can pass at least 500 hrs Hi temp operating life test in a system where the solder joint is subject to 120 degree C. Any recommendation?
Best regards,
ct
Hi,
I'm looking for a type of solder paste which is tested and found pass under 120 deg C operating condition for long hours. Can any one shed some light here?
Best regards,
ct
Sorry for leading you gys to the lousy file hosting site. ya, in fact, i wasn't happy either with the too much of the ads.
Scotty,
Perhaps I should give you more info in order for you "investigate" further.
1) The boards are made by one PCB manufacturer, a same batch of boards run by the two...
Hello Scotty,
Yes, the affected are is actually with OSP finish and not covered with solder during the reflow.
The two sub-cons are running the process in the same manner, no washing no drying process. Both use lead free solder paste but of different brand and are given the liberty to tweak the...
Hi all,
I'm not sure if this is the right place to ask this question, but here is how it goes:
I have two SMT sub-con houses who are equal in terms of their equipment. My product is a two layer PCBs which the top and bottom copper are OSP treated. The issue I'm facing is that one of the sub-con...
Hi,
Has anyone got any data to show whether temperature cycle or constant high temperature would cause bigger impact to warpage on FR4 PCB.
Best regards,
ct