To clarify, I am talking about this from an OEM perspective. We use memory devices in our product and have to control the use of these devices when changes from the manufacturers of memory devices occur. When changes occur I have to be concerned with what the affect of the performance...
Memory manufacturing process (sram and dram, etc) regularly go through changes. These changes are typically die shrink. A die shrink yields changes in performance such as faster access time, reduced currents faster rise times, etc. In my past experience it was a normal process to qualify new die...
It is more like refusal. In past lives this wouldnt even be a question.
I guess being in a medical device these things arent improtant (that was sarcasm if you didnt notice)
Thanks for your response. it serves as a sanity check for me.
I am a experienced component engineer that has worked at my current company for 7 months. It is a medical device company. On our "AVL" we have a part # that is described as follows: AVL CAP,0.1UF,50V,Z5U,0805
This particular device configuration is at the high end of the capacitive...
Understanding how many characters are allowed in the part description in your controlling database will dictate some on how much detail that you can include in the description. Typically a noun, modifier, modifier, etc. IE cap,.10uf,50V,10%,X7R,cer,1206,etc.
Although not a description standard...
